Electronics Manufacturing Technology detailed syllabus for Manufacturing Engineering (Manufacturing) for 2019 regulation curriculum has been taken from the Anna Universities official website and presented for the Manufacturing students. For course code, course name, number of credits for a course and other scheme related information, do visit full semester subjects post given below.
For Manufacturing Engineering 7th Sem scheme and its subjects, do visit Manufacturing 7th Sem 2019 regulation scheme. For Professional Elective-IV scheme and its subjects refer to Manufacturing Professional Elective-IV syllabus scheme. The detailed syllabus of electronics manufacturing technology is as follows.
Course Objective:
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Unit I
Introduction To Electronics Manufacturing
History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed circuit board -fabrication, types, single sided, double sided, multi-layer and flexible printed circuit board
Unit II
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Unit III
Surface Mount Technology
SMT Process, SMT equipment and material handling systems, handling of components and assemblies – moisture sensitivity and ESD, safety and precautions needed, IPC and other standards, stencil printing process – solder paste material, storage and handling, stencils and squeegees, process parameters, quality control. Component placement- equipment type, flexibility, accuracy of placement, throughput, packaging of components for automated assembly, soldering- wave soldering, reflow process, process parameters, profile generation and control, adhesive, underfill and encapsulation process
Unit IV
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Unit V
Repair, Rework, Quality and Reliability of Electronics Assemblies
Repair and rework of PCB- Coating removal, base board repair, conductor repair, thermomechanical effects and thermal management, Reliability fundamentals, reliability testing, failure analysis, design for manufacturability, assembly, reworkability, testing, reliability, and environment.
Course Outcome:
For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdfs platform to make students’s lives easier..
Text Books:
- Prasad R., “Surface Mount Technology – Principles and practice”,2nd Edition, Chapman and Hall., New York, 1997, ISBN 0-41-12921-3.
- Tummala R.R., “Fundamentals of microsystem packaging”, Tata McGraw Hill Co. Ltd., New Delhi, 2001, ISBN 00-71-37169-9.
References:
- Harper C.A., “Electronic Packaging and Interconnection Handbook” 2nd Edition, McGraw Hill Inc., New York, N.Y., 1997, ISBN 0-07-026694-8.
- Lee N.C., “Reflow Soldering Process and Trouble Shooting SMT, BGA, CSP and Flip Chip Technologies”, Elsevier Science. United Kingdom, 2001.
- Puligandla Viswanadham and Pratap Singh., “Failure Modes and Mechanisms in Electronic Packages”, Chapman and Hall., New York, 1997, N.Y. ISBN 0-412-105591-8. Science and Technology, United Kingdom, 1997, ISBN 0750698756.
- Totta P., Puttlitz K. and Stalter K., “Area Array Interconnection Handbook”, Kluwer Academic Publishers, Norwell, MA, United States, 2001, ISBN 0-7923-7919-5.
- Zarrow P. and Kopp D., “Surface Mount Technology Terms and Concepts”, Elsevier, 1997.
For detailed syllabus of all the other subjects of Manufacturing Engineering 7th Sem, visit Manufacturing 7th Sem subject syllabuses for 2019 regulation.
For all Manufacturing Engineering results, visit Anna University Manufacturing all semester results direct link.