Electronics Manufacturing Technology Industrial Engg 5th Sem Syllabus for BE 2017 Regulation Anna Univ (Professional Elective I) detail syllabus for Industrial Engineering (Industrial Engg), 2017 regulation is collected from the Anna Univ official website and presented for students of Anna University. The details of the course are: course code (IE8001), Category (PE), Contact Periods/week (3), Teaching hours/week (3), Practical Hours/week (0). The total course credits are given in combined syllabus.
For all other industrial engg 5th sem syllabus for be 2017 regulation anna univ you can visit Industrial Engg 5th Sem syllabus for BE 2017 regulation Anna Univ Subjects. For all other Professional Elective I subjects do refer to Professional Elective I. The detail syllabus for electronics manufacturing technology is as follows.
Course Objective:
- To understand wafer preparation and PCB fabrication, the types of Mounting Technologies and components for electronics assembly and SMT process in detail.
- To know various Defects, Inspection Equipments SMT assembly process and repair, rework and quality aspects of Electronics assemblies.
Unit I
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Unit II
Components and Packaging
Introduction to packaging, types-Through hole technology(THT) and Surface mount technology(SMT), Through hole components – Axial, radial, multi leaded, odd form. Surface-mount components – Active, passive. Interconnections – Chip to lead interconnection, die bonding, wire bonding, TAB, flip chip, chip on board, multi chip module, direct chip array module, leaded, leadless, area array and embedded packaging, miniaturization and trends.
Unit III
Surface Mount Technology Process
Introduction to the SMT Process, SMT equipment and material handling systems, handling of components and assemblies – Moisture sensitivity and ESD, safety and precautions needed, IPC and other standards, stencil printing process – Solder paste material, storage and handling, stencils and squeegees, process parameters, quality control. Component placement- equipment type, flexibility, accuracy of placement, throughput, packaging of components for automated assembly, Cp and Cpk and process control. soldering- Reflow process, process parameters, profile generation and control, solder joint metallurgy, adhesive, underfill and encapsulation process – applications, materials, storage and handling, process and parameters.
Unit IV
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Unit V
Repair, Rework, Quality and Reliability of Electronics Assemblies
Repair tools, methods, rework criteria and process, thermo-mechanical effects and thermal management, Reliability fundamentals, reliability testing, failure analysis, design for manufacturability, assembly, reworkability, testing, reliability, and environment.
Course Outcome:
- Perform fabrication of PCBs and use of mounting technology for electronic assemblies.
- Perform quality inspection on the PCBs
Text Books:
- Prasad R., Surface Mount Technology – Principles and Practice, Second Edition, Chapman and Hall, New York, 1997
- Tummala R.R., Fundamentals of Microsystem Packaging, McGraw Hill, 2001
References:
- Puligandla Viswanadham and Pratap Singh, Failure Modes and Mechanisms in Electronic Packages, Chapman and Hall, New York, 1997, ISBN 0-412-105591-8.
- Totta P., Puttlitz K. and Stalter K., Area Array Interconnection Handbook, Kluwer Academic Publishers, Norwell, MA, USA, 2001, ISBN 0-7923-7919-5.
- Lee N.C., Reflow Soldering Process and Trouble Shooting SMT,BGA, CSP and Flip Chip Technologies, Elsevier Science, 2001.
- Zarrow P. and Kopp D. Surface Mount Technology Terms and Concepts, Elsevier Science and Technology, 1997, ISBN 0750698756.
- Harper C.A., Electronic Packaging and Interconnection Handbook Second Edition, McGraw Hill Inc., New York, 1997, ISBN 0-07-026694-8.
- Martin B. and Jawitz W., Printed Circuit board materials handbook, McGraw-Hill Professional, 1997.
- Lau J.H., Ball Grid Array Technology, McGraw-Hill Professional, 1997.
- www.ipc.org.
For detail syllabus of all other subjects of BE Industrial Engg, 2017 regulation do visit Industrial Engg 5th Sem syllabus for 2017 Regulation.
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