Electronic Packaging and Testing Ece 7th Sem Syllabus for BE 2017 Regulation Anna Univ (Professional Elective III) detail syllabus for Electronics And Communication Engineering (Ece), 2017 regulation is collected from the Anna Univ official website and presented for students of Anna University. The details of the course are: course code (EC8005), Category (PE), Contact Periods/week (3), Teaching hours/week (3), Practical Hours/week (0). The total course credits are given in combined syllabus.
For all other ece 7th sem syllabus for be 2017 regulation anna univ you can visit Ece 7th Sem syllabus for BE 2017 regulation Anna Univ Subjects. For all other Professional Elective III subjects do refer to Professional Elective III. The detail syllabus for electronic packaging and testing is as follows.
Course Objective:
- To introduce and discuss various issues related to the system packaging
Unit I
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Unit II
Electrical Issues in Packaging
Electrical Issues of Systems Packaging, Signal Distribution, Power Distribution, Electromagnetic Interference, Transmission Lines, Clock Distribution, Noise Sources, Digital and RF Issues. Design Process Electrical Design: Interconnect Capacitance, Resistance and Inductance fundamentals; Packaging roadmaps – Hybrid circuits – Resistive, Capacitive and Inductive parasitics
Unit III
Chip Packages
IC Assembly – Purpose, Requirements, Technologies, Wire bonding, Tape Automated Bonding, Flip Chip, Wafer Level Packaging, reliability, wafer level burn – in and test. Single chip packaging: functions, types, materials processes, properties, characteristics, trends. Multi chip packaging: types, design, comparison, trends. System – in – package (SIP); Passives: discrete, integrated, and embedded
Unit IV
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Unit V
Testing
Reliability, Basic concepts, Environmental interactions. Thermal mismatch and fatigue – failures -thermo mechanically induced -electrically induced – chemically induced. Electrical Testing: System level electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability
Course Outcome:
At the end of the course, the student should be able to:
- Give a comprehensive introduction to the various packaging types used along with the associated thermal, speed, signal and integrity power issues
- Enable design of packages which can withstand higher temperature, vibrations and shock
- Design of PCBs which minimize the EMI and operate at higher frequency
- Analyze the concepts of Testing and testing methods
Text Books:
- Tummala, Rao R., Fundamentals of Microsystems Packaging, McGraw Hill, 2001
References:
- Blackwell (Ed), The electronic packaging handbook, CRC Press, 2000.
- Tummala, Rao R, Microelectronics packaging handbook, McGraw Hill, 2008.
- Bosshart, Printed Circuit Boards Design and Technology, TataMcGraw Hill, 1988.
- R.G. Kaduskar and V.B.Baru, Electronic Product design, Wiley India, 2011
- R.S.Khandpur, Printed Circuit Board, Tata McGraw Hill, 2005
- Recent literature in Electronic Packaging
- Michael L. Bushnell &Vishwani D. Agrawal, Essentials of Electronic Testing for Digital, memory and Mixed signal VLSI Circuits, Kluwer Academic Publishers.2000.
- M. Abramovici, M. A. Breuer, and A.D. Friedman, Digital System Testing and Testable Design, Computer Science Press,1990
For detail syllabus of all other subjects of BE Ece, 2017 regulation do visit Ece 7th Sem syllabus for 2017 Regulation.
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