Electronics Manufacturing Technology detailed syllabus for Mechatronics Engineering (Mechatronics) for 2021 regulation curriculum has been taken from the Anna Universities official website and presented for the Mechatronics students. For course code, course name, number of credits for a course and other scheme related information, do visit full semester subjects post given below.
For Mechatronics Engineering 5th Sem scheme and its subjects, do visit Mechatronics 5th Sem 2021 regulation scheme. For Professional Elective-II scheme and its subjects refer to Mechatronics Professional Elective-II syllabus scheme. The detailed syllabus of electronics manufacturing technology is as follows.
Course Objectives:
Download the iStudy App for all syllabus and other updates.
Unit I
INTRODUCTION TO ELECTRONICS MANUFACTURING 9
History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed circuit board -fabrication, types, single sided, double sided, multi-layer and flexible printed circuit board
Unit II
COMPONENTS AND PACKAGING 9
Introduction to packaging, types-Through hole technology(THT) and Surface mount technology (SMT), Through hole components – axial, radial, multi leaded, odd form Surface-mount components- active, passive. Interconnections – chip to lead interconnection, die bonding, wire bonding, TAB, flip chip, chip on board, multi chip module, direct chip array module, leaded, leadless, area array and embedded packaging, miniaturization and trends.
Unit III
Download the iStudy App for all syllabus and other updates.
Unit IV
INSPECTION AND TESTING 9
Inspection techniques, equipment and principle- AOI, X-ray. Defects and Corrective action -stencil printing process, component placement process, reflow soldering process, electrical testing of PCB assemblies- In circuit test, functional testing, fixtures and jigs.
Unit V
REPAIR, REWORK, QUALITY AND RELIABILITY OF ELECTRONICS
ASSEMBLIES 9
Repair and rework of PCB- Coating removal, base board repair, conductor repair, thermomechanical effects and thermal management, Reliability fundamentals, reliability testing, failure analysis, design for manufacturability, assembly, reworkability, testing, reliability, and environment.
Course Outcomes:
At the end of this course, the students should be able to:
- Perceive wafer preparation and PCB fabrication
- Recognize the importance of Through Hole Technology (THT) and Surface Mount Technology (SMT)
- Demonstrate various steps in Surface Mount Technology (SMT)
- Identify various testing and inspection methods of populated PCBS
- Discuss various techniques in repair, rework, quality and reliability of electronics Assemblies
Text Books:
Download the iStudy App for all syllabus and other updates.
Reference Books:
- Harper C.A., “Electronic Packaging and Interconnection Handbook” 2nd Edition, McGraw Hill Inc., New York, N.Y., 1997, ISBN 0-07-026694-8.
- Lee N.C., “Reflow Soldering Process and Trouble Shooting SMT, BGA, CSP and Flip Chip Technologies”, Elsevier Science. United Kingdom, 2001.
- Puligandla Viswanadham and Pratap Singh., “Failure Modes and Mechanisms in Electronic Packages”, Chapman and Hall., New York, 1997, N.Y. ISBN 0-412-105591-8. Science and Technology, United Kingdom, 1997, ISBN 0750698756.
- Totta P., Puttlitz K. and Stalter K., “Area Array Interconnection Handbook”, Kluwer Academic Publishers, Norwell, MA, United States, 2001, ISBN 0-7923-7919-5.
- Zarrow P. and Kopp D., “Surface Mount Technology Terms and Concepts”, Elsevier, 1997.
For detailed syllabus of all the other subjects of Mechatronics Engineering 5th Sem, visit Mechatronics 5th Sem subject syllabuses for 2021 regulation.
For all Mechatronics Engineering results, visit Anna University Mechatronics all semester results direct link.