Electronics Manufacturing Technology Syllabus for B.Tech 7th sem is covered here. This gives the details about credits, number of hours and other details along with reference books for the course.
The detailed syllabus for Electronics Manufacturing Technology B.Tech (R13) seventhsem is as follows
OBJECTIVES: Upon the completion of the subject, student will be able to:
- Understand wafer preparation and PCB fabrication
- Know the types of Mounting Technologies and components for electronics assembly
- Appreciate SMT process in detail.
- Know various Defects, Inspection Equipments SMT assembly process.
- Learn repair, rework and quality aspects of Electronics assemblies.
UNIT I : INTRODUCTION TO ELECTRONICS MANUFACTURING [8 Hours]
History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed circuit boards, types- single sided, double sided, multi layer and flexible printed circuit board, design, materials, manufacturing, inspection.
UNIT II : COMPONENTS AND PACKAGING [9 Hours]
Introduction to packaging, types-Through hole technology(THT) and Surface mount technology(SMT), Through hole components – axial, radial, multi leaded, odd form. Surface- mount components- active, passive. Interconnections – chip to lead interconnection, die bonding, wire bonding, TAB, flip chip, chip on board, multi chip module, direct chip array module, leaded, leadless, area array and embedded packaging, miniaturization and trends.
UNIT III : SURFACE MOUNT TECHNOLOGY PROCESS [12 Hours]
Introduction to the SMT Process, SMT equipment and material handling systems, handling of components and assemblies – moisture sensitivity and ESD, safety and precautions needed, IPC and other standards, stencil printing process – solder paste material, storage and handling, stencils and squeegees, process parameters, quality control. Component placement- equipment type, flexibility, accuracy of placement, throughput, packaging of components for automated assembly, Cp and Cpk and process control. soldering- reflow process, process parameters, profile generation and control, solder joint metallurgy, adhesive, underfill and encapsulation process – applications, materials, storage and handling, process and parameters.
TOTAL: 45 PERIODS
OUTCOMES:
- Perform fabrication of PCBs and use of mounting technology for electronic assemblies.
- Perform quality inspection on the PCBs
TEXT BOOKS:
- Ray Prasad, “Surface Mount Technology: Principles and Practice”, Second Edition , Chapman and Hall ,1997 ,New York , ISBN 0-41-12921-3
- Rao. R .Tummala, “Fundamentals of Microsystem Packaging”, McGraw Hill, 2001 , ISBN 00- 71-37169-9
REFERENCES:
- Puligandla Viswanadham and Pratap Singh, “Failure Modes and Mechanisms in Electronic Packages”, Chapman and Hall, New York , N.Y. ISBN 0-412-105591-8
- Paul Totta and Karl Puttlitz, and Kathleen Stalter, “Area Array Interconnection Handbook”, Kluwer Academic Publishers, Norwell, MA, USA, 2001. ISBN 0-7923 7919-5.
- Ning-Cheng Lee, “Reflow Soldering Process and Trouble Shooting SMT,BGA, CSP and Flip Chip Technologies” ,Elsevier Science, ISBN 0-7506-7218-8.
- Phil Zarrow, “Surface Mount Technology Terms and Concepts”, Elsevier Science and Technology,1997.ISBN 0750698756
- C.A.Harper, “Electronic Packaging and Interconnection Handbook”, Second Edition, McGraw Hill Inc., New York, N.Y.,1997,ISBN 0-07-026694-8
For all other B.Tech MF 7th sem syllabus go to Anna University B.Tech MANUFACTURING ENGINEERING (MF) 7th Sem Course Structure for (R13) Batch. All details and yearly new syllabus will be updated here time to time. Subscribe, like us on facebook and follow us on google plus for all updates.
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