Hybrid Circuits and Packaging detail syllabus for Nanoelectronics (Nano), 2017 scheme is taken from VTU official website and presented for VTU students. The course code (17NT651), and for exam duration, Teaching Hr/week, Practical Hr/week, Total Marks, internal marks, theory marks, duration and credits do visit complete sem subjects post given below.
For all other nano 6th sem syllabus for be 2017 scheme vtu you can visit Nano 6th Sem syllabus for BE 2017 Scheme VTU Subjects. For all other Professional Elective-II subjects do refer to Professional Elective-II. The detail syllabus for hybrid circuits and packaging is as follows.
Course Objectives:
- To understand the basics of hybrid microcircuits, mathematical foundations and CAD design for hybrid microcircuits
- To learn packaging of electronic devices, techniques for nano and bio packaging, nanomaterials for packaging
- To design and develop 3D models for packaging
Module 1:
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Module 2:
MATHEMATICAL FOUNDATIONS OF HYBRID CIRCUITS Mathematical foundations, circuit design and layout rules, Computer aided design and pattern generation
Module 3:
FUTURE OF PACKAGING Packaging for Electronic systems, system integration by advanced electronics packaging, nano and bio techniques for electronic device packaging
Module 4:
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Module 5:
NANOMATERIALS FOR MICROELECTRONIC AND BIO PACKAGING packaging of bio-micro-electro-mechanical systems (BIOMEMS) and microfluidic chips, packaging of miomolecular and chemical microsensors
Course Outcomes:
After successfully completing this course, students will be able to:
- Understand the fundamentals of hybrid micro circuits and importance of hybrid circuits in various industries
- Evaluate and determine the standards, technological challenges and future trends of nano and bio techniques for electronic device packaging
- Initiate, innovate and develop nanotechnology based solutions in the field of electronics packaging
Graduate Attributes (as per NBA):
- Engineering Knowledge.
- Problem Analysis.
- Design / development of solutions (partly).
- Interpretation of data.
Question paper pattern:
- The question paper will have ten questions.
- Each full Question consisting of 20 marks
- There will be 2 full questions (with a maximum of four sub questions) from each module.
- Each full question will have sub questions covering all the topics under a module.
- The students will have to answer 5 full questions, selecting one full question from each module.
Text Books:
- Tapan K. Gupta, Handbook of Thick and Thin Film Hybrid Microelectronics, Wiley Interscience, John Wiley & Sons, 2003.
- http://onlinelibrary.wiley.com/doi/10.1002/0471723673.fmatter/pdf
- Gerald Gerlach, Klaus-Jurgen Wolter, Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Packaging, Springer, 2012.
- C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li, Nano-Bio- Electronic, Photonic and MEMS Packaging, Springer Science & Business Media, 2014.
Reference Books:
- Gerald Gerlach, K.-F. Arndt, Hydrogel Sensors and Actuators: Engineering and Technology, Springer, 2009
- Daniel Lu, C.P. Wong, Materials for Advanced Packaging, Springer, 2016
- Yan Li, Deepak Goyal, 3D Microelectronic Packaging: From Fundamentals to Applications, Springer, 2017
For detail syllabus of all other subjects of BE Nano, 2017 regulation do visit Nano 6th Sem syllabus for 2017 Regulation.
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