Microelectronics Microelectronics 6th Sem Syllabus for Diploma BTEUP 2017

Microelectronics detail BTEUP Diploma syllabus for Electronics Engineering (Microelectronics), effective from 2017 is collected from BTEUP 2017 Syllabus official website and presented for diploma students. The course details such as exam duration, Teaching Hr/week, Practical Hr/week, Total Marks, internal marks, theory marks, duration and credits do visit complete sem subjects post given below. The syllabus PDFs can be downloaded from official website.

For all other microelectronics 6th sem bteup diploma syllabus 2017 you can visit Microelectronics 6th Sem BTEUP Diploma Syllabus 2017 Subjects. The detail syllabus for microelectronics is as follows.

1. INTRODUCTION :

Importance of micro-electronics in modern technology.

2. CRYSTAL PROPERTIES AND GROWTH OF SEMICONDUCTORS BULK :

1. Crystal Lattics, Periodic structures, Planes and directions, diamond and zinc-blende lattice.
2. Crystal Growth from Melt.
3. Zone Refining.
4. Wafer shaping, Cleaning and polishing.

3. REVIEW OF SEMI-CONDUCTOR PROPERTIES :

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4. EPITAXIAL GROWTH :

1. Lattice matching, Need for epitaxy, Vapour phase epitaxy, Liquid phase epitaxy and Molecular-Beam epitaxy, Silicon on insulators.

5. OXIDATION & POLYSILICON FILM DEPOSITION :

1. Thermal oxidation, Dietectric and Polysilicon deposition, Metallization, Basic processes of vacuum evaporation Patterning techniques, Metallization Application.

6. DIFFUSION & ION INPLATATION :

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7. LITHOGRAPHY & ETCHING :

1. Optical lithography, X-ray lithography, Ion

lithography, Electron beam lithography, Wet chemical etching, Dry chemical etching.

8. DISCRETE DEVICE FABRICATION :

1. Fabrication of p-n junction, Bipolar junction transistor, JFET.

9. INTRODUCTION TO MOS:

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10. INTEGRATED CIRCUITS :

1. Advantages of integration, Tyes of integrated circuits, Monolithic and Hybrid circuits.
2. Masking, Selective doping, Fine-line lithography and isolation for Monolithic circuits.
3. Introduction to monolithic device elements such as BJT, MOS, transistor and integration of other circuit elements.
4. Very large scale ingegration (V.L.S.I.).

11. TESTING, BONDING AND PACKAGING :

Testing, Wire bonding, Flip-cheap and Beam-lead techniques, Packings.

12. Basic circuit for analog and digital ICs,functional elements available in the market.

Reference Books:

1. S. M. Sze – VLSI Technology- Tata McGraw Hill-IInd Ed.
2. Campbell, Stephen A- The Science & Engineering of Microelectronic Fabrication- Oxford university Press.
3. S. Gandhi-VLSI Fabrication Principle- John Wiley
4. Puckness Douglas A, Eshraghiaw Kamran “Basic VLSI Design” -Prentice Hall (India)

For detail syllabus of all other subjects of BE Microelectronics, effective from 2017 do visit Microelectronics 6th Sem BTEUP syllabus for 2017.

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