Engineering Mechanics and Materials Microelectronics 1st Sem BTEUP Syllabus 2019-2020

Engineering Mechanics and Materials detail BTEUP syllabus for Electronics Engineering (Microelectronics), effective from 2019-2020, is collected from BTEUP 2017 Syllabus official website and presented for diploma students. PDF download is possible from official site but you can download the istudy mobile app for syllabus on mobile. The course details such as exam duration, Teaching Hr/week, Practical Hr/week, Total Marks, internal marks, theory marks, duration and credits do visit complete sem subjects post given below. The syllabus PDFs can be downloaded from official website.

For all other bteup syllabus 1st sem microelectronics 2019-2020 you can visit BTEUP Syllabus 1st Sem Microelectronics 2019-2020 Subjects. The detail syllabus for engineering mechanics and materials is as follows.

Rationale:

Engineering Mechanics & Materials Subject is quite essential for a student of electronics engineering diploma programme. The subject will expose the concept like force analysis, condition of equilibrium, types of materials to be used in electronic application. Lot of development has taken place in the field of materials. New materials are being developed and it has become possible to change the properties of materials to suit the requirements.

Learning Outcomes:

After undergoing the subject, the student will be able to:

• Understand the basic laws and principles of mechanics.
• Able to analyze and solve simple problems related to engineering mechanics.
• Understand the characteristics and properties of different materials used in electronics.

1. Introduction (08 Periods)

For complete syllabus and results, class timetable and more pls download iStudy Syllabus App. It’s a lightweight, easy to use, no images, no pdfs platform to make students life easier.

2. Force Analysis (13 Periods)

Concept of coplanar and non-coplanar forces including parallel forces, Concurrent and non-concurrent forces, Resultant forces, Equilibrium of forces, Law of parallelogram of forces, Law of triangle of forces and its converse. Law of polygon of forces. Solution of simple engineering problems by analytical and graphical methods such as simple wall crane, jib crane and other structures. Determination of resultant of any number of forces in one plane acting upon a particle, condition of equilibrium of coplanar concurrent force system.

3. General Condition of Equilibrium: (11 Periods)

General condition of equilibrium of a rigid body under the action of coplanar forces, statement of force law of equilibrium, moment law of equilibrium, application of above on body.

4. Stresses and strains (12 Periods)

For complete syllabus and results, class timetable and more pls download iStudy Syllabus App. It’s a lightweight, easy to use, no images, no pdfs platform to make students life easier.

5. Materials & Concept Used In Electronics (12 Periods)

1. Soldering materials: Type, chemical composition and properties, Soldering alloy – Tin lead, Tin antimony, Tin silver, Lead silver, Tin zinc, Different types of flux and their properties, Properties of plastics materials, Epoxy materials for PCB (Single and multi-layer board), Emulsion parameters, Film emulsion, Type of laminates (Phenolic, Epoxy, Polyester, Silicon, Melamine, Polyamide), Properties of copper clad laminates, Materials (Filler, Resin, Copper Foil) Photo printing basics for double sided PCB, photo resin materials coating process materials, Screen printing and its materials Etching agent, Film processing and used materials.
2. Soldering & Brazing: For black Galvanized and Tin Coated Iron sheet, Brass and copper sheets only.
1. Its concept, comparison with welding as joining method and classification, electric soldering and forge soldering.
2. Soldering operation – edge preparation of joints, pickling and degreasing, Fluxing, Tinning and Soldering. Wave soldering, solder mask, Dip soldering, Drag soldering,
3. Materials Used-Common fluxes, soft and hard solder, solder wire (Plain and Resin core) and sticks, spelters and their specifications and description (For Identification Only), forge soldering bits.
4. Electric soldering iron, other soldering tools.
5. Common defects likely to occurs during and after soldering.
6. Safety of Personnel, Equipment & Tools to be observed.

Instructional Strategy:

Engineering mechanics and materials needs to be handled very carefully in such a manner that students develop clear understanding of basic laws and principles of mechanics. The teacher may lay more emphasis on numerical analysis and give assignments to inculcate self-study.

Means of Assessment:

For complete syllabus and results, class timetable and more pls download iStudy Syllabus App. It’s a lightweight, easy to use, no images, no pdfs platform to make students life easier.

Text Books:

1. A Text Book of Engineering Mechanics (Applied Mechanics) by R.K. Khurmi;S.Chand and Co. Ltd. New Delhi
2. A Text Book of Applied Mechanics by R.K. Rajput;Laxmi Publications.
3. A Text Book of Materials Science by R.K. Rajpur;Katson Publications, Ludhiana
4. Material Science and Processes by Hazara Chaudhary; Indian Book Distributors
5. E-books/e-tools/relevant software to be used as recommended by AICTE/NITTTR, Chandigarh.

For detail syllabus of all other subjects of BE Microelectronics, effective from 2019-2020 do visit Microelectronics 1st Sem BTEUP syllabus for 2019-2020.

Dont forget to download iStudy Syllabus App for latest syllabus and results, class timetable and more.