Applied Mathematics-I(A) detail BTEUP Diploma syllabus for Electronics Engineering (Modern Consumer Electronics Appliance), effective from 2017 is collected from BTEUP 2017 Syllabus official website and presented for diploma students. The course details such as exam duration, Teaching Hr/week, Practical Hr/week, Total Marks, internal marks, theory marks, duration and credits do visit complete sem subjects post given below. The syllabus PDFs can be downloaded from official website.
For all other modern consumer elec appliance 1st sem bteup diploma syllabus 2017 you can visit Modern Consumer Elec Appliance 1st Sem BTEUP Diploma Syllabus 2017 Subjects. The detail syllabus for applied mathematics-i(a) is as follows.
Rationale:
The study of mathematics is an important requirement for the understanding and development of any branch of engineering. The purpose of teaching mathematics to diploma engineering students is to impart them basic knowledge of mathematics which is needed for full understanding and study of engineering subjects.
1. Introduction:
Mechanics and its utility. Concept of scaler and vector quantities. Effect of a force. Tension & compression. Rigid body. Principle of physical independence of force. Principle of transmissibility of a force.
2. Forces Analysis:
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3. General Condition of Equilibrium:
General condition of equilibrium of a rigid body under the action of coplaner forces, statement of force law
of equilibrium, moment law of equilibrium, application of above on body.
4. Stresses and strains:
Concept of stress and strain. Concept of various types of stresses and strains . Definitions of tension, compression shear, bending, torsion. Concept of volumetric and lateral strains, Poisson’s ratio. Mechanical properties of MS, SS, CI Al and etc.
5. Beams & Trusses:
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6. MATERIALS & CONCEPT USED IN ELECTRONICS :
Soldering materials – Type, chemical composition and properties, Soldering alloys – Tin lead, Tin antimony, Tin silver, Lead silver, Tin zinc, Different types of flux and their properties, Properties of plastics materials, Epoxy materials for PCB (Single and multi layer board), Emulsion parameters, Film emulsion, Type of laminates (Phenolic, Epoxy, Polyster, Silicon, Melamine, Polymide), Properties of copper clad laminates, Material (Filler, Resin, Copper Foil) Photo printing basic for double side PCB, Photo resin materials coating process materials, Screen printing and its materials Etching agent, Film processing and used materials.
Soldering & Brazing:
For black Galvanised and Tincoated Iron sheet, brass and copper sheets only.
- Its concept, comparison with welding as joining method and classification, electric soldering and forge soldering.
- Soldering operation- edge preparation of joints, Pickling and degreasing, Fluxing, Tinning and Soldering. Wave soldering, solder mask, Dip soldering, Drag soldering,
- Materials Used-Common fluxes, soft and hard solder, solder wire (Plain and Resin core) and sticks, spelters and their specifications and discription ( For Identification Only), forge soldering bits.
- Electric soldering iron, other soldering tools.
- Common defects likely to occurs during and after soldering.
- Safety of Personnel, Equipment & Tools to be observed
For detail syllabus of all other subjects of BE Modern Consumer Elec Appliance, effective from 2017 do visit Modern Consumer Elec Appliance 1st Sem BTEUP syllabus for 2017.
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