EEE

7EC6-60.2: Micro and Smart System Technology Syllabus for EEE 7th Sem 2020-21 Regulation RTU (Open Elective-1)

Micro and Smart System Technology detailed syllabus for Electrical & Electronics Engineering (EEE) for 2020-21 regulation curriculum has been taken from the Rajasthan Technical University official website and presented for the electrical & electronics engineering students. For course code, course name, number of credits for a course and other scheme related information, do visit full semester subjects post given below.

For Electrical & Electronics Engineering 7th Sem scheme and its subjects, do visit EEE 7th Sem 2020-21 regulation scheme. For Open Elective-1 scheme and its subjects refer to EEE Open Elective-1 syllabus scheme. The detailed syllabus of micro and smart system technology is as follows.

Micro and Smart System Technology

Unit 1

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
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Unit 2

INTRODUCTION TO MICRO AND SMART SYSTEMS: (a) Smart-material systems- History, Introduction and evolution of smart materials, structures and systems. Components of a smart system. Application areas. Commercial products. (b) Microsystems- Introduction, History and their evolution, Feynman’s vision. Micromachined transducers. Evolution of micro-manufacturing. Multi-disciplinary aspects. Applications areas. Commercial products.

Unit 3

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdfs platform to make students’s lives easier.
Get it on Google Play.

Unit 4

MICROMANUFACTURING AND MATERIAL PROCESSING: a. Silicon wafer processing, lithography, thin-film deposition, etching (wet and dry), wafer-bonding, and metallization. b. Silicon micromachining: surface, bulk, moulding, bonding based process flows. c. Thick-film processing: d. Smart material processing: e. Processing of other materials: ceramics, polymers and metals f. Emerging trends.

Unit 5

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdfs platform to make students’s lives easier.
Get it on Google Play.

Unit 6

INTEGRATION AND PACKAGING OF MICROELECTRO MECHANICAL SYSTEMS: Integration of microelectronics and micro devices at wafer and chip levels. Microelectronic packaging: wire and ball bonding, flip-chip. Low temperature-cofired-ceramic (LTCC) multi-chip-module technology. Microsystem packaging examples. Examples from smart systems and micromachined accelerometer or a thermal cycler BEL pressure sensor, thermal cycler for DNA amplification, and active vibration control of a beam

Text/Reference Books:

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdfs platform to make students’s lives easier.
Get it on Google Play.

For detailed syllabus of all other subjects of Electrical & Electronics Engineering, 2020-21 regulation curriculum do visit EEE 7th Sem subject syllabuses for 2020-21 regulation.

For all Electrical & Electronics Engineering results, visit Rajasthan Technical University electrical & electronics engineering all semester results direct link.

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