Surface Mounting Technology detailed syllabus scheme for Electronics Engineering (EL), 2020-21 onwards has been taken from the DBATU official website and presented for the Bachelor of Technology students. For Subject Code, Course Title, Lecutres, Tutorials, Practice, Credits, and other information, do visit full semester subjects post given below.
For 8th Sem Scheme of Electronics Engineering (EL), 2020-21 Onwards, do visit EL 8th Sem Scheme, 2020-21 Onwards. For the Elective-VI scheme of 8th Sem 2020-21 onwards, refer to EL 8th Sem Elective-VI Scheme 2020-21 Onwards. The detail syllabus for surface mounting technology is as follows.
Surface Mounting Technology Syllabus for Electronics Engineering (EL) 4th Year 8th Sem 2020-21 DBATU
UNIT – 1 Introduction To Electronics Manufacturing
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UNIT – 2 Components and Packaging
Introduction To Packaging, Types-Through Hole Technology(THT) And Surface Mount Technology(SMT), Through Hole Components – Axial, Radial, Multi Leaded, Odd Form. Surface- Mount Components- Active, Passive. Interconnections – Chip To Lead Interconnection, Die Bonding, Wire Bonding, TAB, Flip Chip, Chip On Board, Multi Chip Module, Direct Chip Array Module, Leaded, Leadless, Area Array And Embedded Packaging, Miniaturization And Trends.
UNIT – 3 Introduction to the SMT Process, SMT Equipment and Material Handling Systems
Handling Of Components And Assemblies – Moisture Sensitivity And ESD, Safety And Precautions Needed, IPC And Other Standards, Stencil Printing Process – Solder Paste Material, Storage And Handling, Stencils And Squeegees, Process Parameters, Quality Control.
UNIT – 4 Soldering- Process and Component Placement
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Unit – 5 Inspection and Testing
Inspection Techniques, Equipment and Principle – AOI, X-Ray, Defects And Corrective Action – Stencil Printing Process, Component Placement Process, Reflow Soldering Process, Underfill and Encapsulation Process, Electrical Testing Of PCB Assemblies- In Circuit Test, Functional Testing, Fixtures And Jigs.
UNIT – 6 Repair, Rework, Quality and Reliability of Electronics Assemblies
Repair Tools, Methods, Rework Criteria and Process, Thermo-Mechanical Effects And Thermal Management, Reliability Fundamentals, Reliability Testing, Failure Analysis, Design For Manufacturability, Assembly, Reworkability, Testing, Reliability, And Environment
Reference Books:
For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
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For detail syllabus of all subjects of Electronics Engineering (EL) 8th Sem 2020-21 onwards, visit EL 8th Sem Subjects of 2020-21 Onwards.