BTEXPE506D: Introduction To Mems Syllabus for ET 5th Sem 2019-20 DBATU (Elective-I)

Introduction To Mems detailed syllabus scheme for Electronics & Telecommunication Engineering (ET), 2019-20 onwards has been taken from the DBATU official website and presented for the Bachelor of Technology students. For Subject Code, Course Title, Lecutres, Tutorials, Practice, Credits, and other information, do visit full semester subjects post given below.

For 5th Sem Scheme of Electronics & Telecommunication Engineering (ET), 2019-20 Onwards, do visit ET 5th Sem Scheme, 2019-20 Onwards. For the Elective-I scheme of 5th Sem 2019-20 onwards, refer to ET 5th Sem Elective-I Scheme 2019-20 Onwards. The detail syllabus for introduction to mems is as follows.

Introduction To Mems Syllabus for Electronics & Telecommunication Engineering (ET) 3rd Year 5th Sem 2019-20 DBATU

Course Objectives:

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdf platform to make students’s lives easier.
.

Course Outcomes:

At the end of the course the students will be able to

1. Appreciate the underlying working principles of MEMS and NEMS devices.
2. Design and model MEM devices.

UNIT – 1

Introduction to MEMS Introduction, History, Concepts of MEMS: Principles, application and design, Scaling Properties/Issues, Micromachining Processes: Substrates, lithography, wet/dry etching processes, deposition processes, film stress, exotic processes. Mechanical Transducers: transduction methods, accelerometers, gyroscopes, pressure sensors, MEMS microphones, mechanical structures, actuators.

UNIT – 2

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdf platform to make students’s lives easier.
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UNIT – 3

Review of Basic MEMS fabrication modules: MEMS fabrication modules, Oxidation, Deposition Techniques, Lithography (LIGA), and Etching

UNIT – 4

Micromachining Micromachining, Surface Micromachining, sacrificial layer processes, Stiction; Bulk Micromachining, Isotropic Etching and Anisotropic Etching, Wafer Bonding

UNIT – 5

For the complete syllabus, results, class timetable, and many other features kindly download the iStudy App
It is a lightweight, easy to use, no images, and no pdf platform to make students’s lives easier.
.

UNIT – 6

Overview of Finite Element Method, Modeling of Coupled Electromechanical Systems.

Text Books:

1. G. K. Ananthasuresh, K. J. Vinoy, S. Gopalkrishnan K. N. Bhat, V. K. Aatre, Micro and Smart Systems, Wiley India, 2012.
2. S. E.Lyshevski, Nano-and Micro-Electromechanical systems: Fundamentals of Nano-and Microengineering (Vol. 8). CRC press, (2005).
3. S. D. Senturia, Microsystem Design, Kluwer Academic Publishers, 2001.
4. M. Madou, Fundamentals of Microfabrication, CRC Press, 1997.
5. G. Kovacs, Micromachined Transducers Sourcebook, McGraw-Hill, Boston, 1998.
6. M.H. Bao, Micromechanical Transducers: Pressure sensors, accelerometers, and Gyroscopes, Elsevier, New York, 2000.

For detail syllabus of all subjects of Electronics & Telecommunication Engineering (ET) 5th Sem 2019-20 onwards, visit ET 5th Sem Subjects of 2019-20 Onwards.