{"id":12421,"date":"2018-09-10T18:13:24","date_gmt":"2018-09-10T18:13:24","guid":{"rendered":"https:\/\/www.inspirenignite.com\/jntuh\/?p=12421"},"modified":"2026-05-24T10:28:17","modified_gmt":"2026-05-24T04:58:17","slug":"jntuh-m-tech-2017-2018-r17-detailed-syllabus-mems","status":"publish","type":"post","link":"https:\/\/www.inspirenignite.com\/jntuh\/jntuh-m-tech-2017-2018-r17-detailed-syllabus-mems\/","title":{"rendered":"JNTUH M.Tech 2017-2018 (R17) Detailed Syllabus MEMS"},"content":{"rendered":"MEMS Detailed Syllabus for Mechatronics M.Tech first year second sem is covered here. This gives the details about credits, number of hours and other details along with reference books for the course.\r\n\r\nThe detailed syllabus for MEMS M.Tech 2017-2018 (R17) first year second sem is as follows.\r\n\r\nM.Tech. I Year II Sem.\r\n\r\nUNIT – I: Overview and working principles of MEMS and Microsystems<\/strong>: MEMS & Microsystems, Evolution of Micro fabrication, Microsystems & Microelectronics, Microsystems & miniaturization, Applications of MEMS in Industries, Micro sensors, Micro actuation, MEMS with Micro actuators Micro accelerometers, Micro fluidics\r\n\r\nUNIT – II: Engineering Science for Microsystems Design and Fabrication<\/strong>: Atomic structure of Matter, Ions and Ionization, Molecular Theory of Matter and Intermolecular Forces, Doping of Semiconductors, The Diffusion Process, Plasma Physics, Electrochemistry, Quantum Physics.\r\n\r\nUNIT – III: Engineering Mechanics for Microsystems Design:<\/strong> Static Bending of Thin plates, Mechanical Vibration, Thermo mechanics , Fracture Mechanics, Thin- Film Mechanics, Overview of Finite Element Stress Analysis\r\n\r\nUNIT – IV: Thermo Fluid Engineering & Microsystems Design:<\/strong> Overview of Basics of Fluid Mechanics in Macro and Mesoscales, Basic equations in Continum Fluid Dynamics, Laminar Fluid Flow in Circular Conduits, Computational Fluid Dynamics, Incompressible Fluid Flow in Micro conduits, Fluid flow in Sub micrometer and Nano scale, Overview of Heat conduction in Solids, Heat Conduction in Multilayered Thin films and in solids in sub micrometer scale, Design Considerations, Process Design Mechanical Design, Mechanical design using FEM, Design of a Silicon Die for a Micro pressure sensor.\r\n\r\nUNIT – V: Materials for MEMS & Microsystems and their fabrication:<\/strong> Substrates and Wafers, Active substrate materials, Silicon as a substrate material, Silicon compounds, Silicon Piezoresistors, Gallium Arsenide, Quartz, Piezoelectric Crystals and Polymers, Photolithography, Ion implantation, Diffusion and oxidation, Chemical and Physical vapor deposition, etching, Bulk micro manufacturing, Surface Micromachining, The LIGA Process.\r\n\r\nREFERENCE BOOKS:<\/strong>\r\n