{"id":58287,"date":"2023-09-02T17:08:21","date_gmt":"2023-09-02T17:08:21","guid":{"rendered":"https:\/\/www.inspirenignite.com\/anna-university\/cmr350-electronics-manufacturing-technology-syllabus-for-robotics-2021-regulation-professional-elective-ii\/"},"modified":"2023-09-02T17:08:21","modified_gmt":"2023-09-02T17:08:21","slug":"cmr350-electronics-manufacturing-technology-syllabus-for-robotics-2021-regulation-professional-elective-ii","status":"publish","type":"post","link":"https:\/\/www.inspirenignite.com\/anna-university\/cmr350-electronics-manufacturing-technology-syllabus-for-robotics-2021-regulation-professional-elective-ii\/","title":{"rendered":"CMR350: Electronics Manufacturing Technology syllabus for Robotics 2021 regulation (Professional Elective-II)"},"content":{"rendered":"

Electronics Manufacturing Technology detailed syllabus for Robotics & Automation Engineering (Robotics) for 2021 regulation curriculum has been taken from the Anna Universities<\/a> official website and presented for the Robotics students. For course code, course name, number of credits for a course and other scheme related information, do visit full semester subjects post given below. <\/p>\n

For Robotics & Automation Engineering 5th Sem scheme and its subjects, do visit Robotics 5th Sem 2021 regulation scheme<\/a>. For Professional Elective-II scheme and its subjects refer to Robotics Professional Elective-II syllabus scheme<\/a>. The detailed syllabus of electronics manufacturing technology is as follows. <\/p>\n

Course Objectives:<\/h4>\n

Download the iStudy App for all syllabus and other updates.<\/a>
\"Get<\/a><\/h4>\n

Unit I<\/h4>\n

INTRODUCTION TO ELECTRONICS MANUFACTURING\t9<\/strong>
\nHistory, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed circuit board -fabrication, types, single sided, double sided, multi-layer and flexible printed circuit board\n<\/p>\n

Unit II<\/h4>\n

COMPONENTS AND PACKAGING\t9<\/strong>
\nIntroduction to packaging, types-Through hole technology(THT) and Surface mount technology (SMT), Through hole components – axial, radial, multi leaded, odd form Surface-mount components- active, passive. Interconnections – chip to lead interconnection, die bonding, wire bonding, TAB, flip chip, chip on board, multi chip module, direct chip array module, leaded, leadless, area array and embedded packaging, miniaturization and trends.\n<\/p>\n

Unit III<\/h4>\n

Download the iStudy App for all syllabus and other updates.<\/a>
\"Get<\/a><\/h4>\n

Unit IV<\/h4>\n

INSPECTION AND TESTING\t9<\/strong>
\nInspection techniques, equipment and principle- AOI, X-ray. Defects and Corrective action – stencil printing process, component placement process, reflow soldering process, electrical testing of PCB assemblies- In circuit test, functional testing, fixtures and jigs.\n<\/p>\n

Unit V<\/h4>\n

REPAIR, REWORK, QUALITY AND RELIABILITY OF ELECTRONICS
\nASSEMBLIES\t9
\nRepair and rework of PCB- Coating removal, base board repair, conductor repair, thermomechanical effects and thermal management, Reliability fundamentals, reliability testing, failure analysis, design for manufacturability, assembly, reworkability, testing, reliability, and environment.\n<\/p>\n

Course Outcomes:<\/h4>\n

At the end of this course, the students should be able to:<\/p>\n

    \n
  1. Perceive wafer\tpreparation\tand PCB fabrication<\/li>\n
  2. Recognize the\timportance\tof Through Hole Technology (THT) and Surface Mount Technology (SMT)<\/li>\n
  3. Demonstrate various steps\tin Surface Mount Technology (SMT)<\/li>\n
  4. Identify various\ttesting and\tinspection methods of populated PCBS<\/li>\n
  5. Discuss various techniques in repair, rework, quality and reliability of electronics Assemblies<\/li>\n<\/ol>\n

    Text Books:<\/h4>\n

    Download the iStudy App for all syllabus and other updates.<\/a>
    \"Get<\/a><\/h4>\n

    Reference Books:<\/h4>\n
      \n
    1. Harper C.A., \u201cElectronic Packaging and Interconnection Handbook\u201d 2nd Edition, McGraw Hill Inc., New York, N.Y., 1997, ISBN 0-07-026694-8.<\/li>\n
    2. Lee N.C., \u201cReflow Soldering Process and Trouble Shooting SMT, BGA, CSP and Flip Chip Technologies\u201d, Elsevier Science. United Kingdom, 2001.<\/li>\n
    3. Puligandla Viswanadham and Pratap Singh., \u201cFailure Modes and Mechanisms in Electronic Packages\u201d, Chapman and Hall., New York, 1997, N.Y. ISBN 0-412-105591-8. Science and Technology, United Kingdom, 1997, ISBN 0750698756.<\/li>\n
    4. Totta P., Puttlitz K. and Stalter K., \u201cArea Array Interconnection Handbook\u201d, Kluwer Academic Publishers, Norwell, MA, United States, 2001, ISBN 0-7923-7919-5.<\/li>\n
    5. Zarrow P. and Kopp D., \u201cSurface Mount Technology Terms and Concepts\u201d, Elsevier, 1997.<\/li>\n<\/li>\n<\/ol>\n

      For detailed syllabus of all the other subjects of Robotics & Automation Engineering 5th Sem, visit Robotics 5th Sem subject syllabuses for 2021 regulation<\/a>. <\/p>\n

      For all Robotics & Automation Engineering results, visit Anna University Robotics all semester results<\/a> direct link. <\/p>\n","protected":false},"excerpt":{"rendered":"

      Electronics Manufacturing Technology detailed syllabus for Robotics & Automation Engineering (Robotics) for 2021 regulation curriculum has been taken from the Anna Universities official website and presented for the Robotics students. […]<\/p>\n","protected":false},"author":2297,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"footnotes":""},"categories":[64],"tags":[],"class_list":["post-58287","post","type-post","status-publish","format-standard","hentry","category-robotics"],"_links":{"self":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/posts\/58287","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/users\/2297"}],"replies":[{"embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/comments?post=58287"}],"version-history":[{"count":0,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/posts\/58287\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/media?parent=58287"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/categories?post=58287"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/tags?post=58287"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}