{"id":33971,"date":"2021-05-22T07:40:40","date_gmt":"2021-05-22T07:40:40","guid":{"rendered":"https:\/\/www.inspirenignite.com\/anna-university\/mf5005-electronics-manufacturing-technology-syllabus-for-manufacturing-7th-sem-2019-regulation-anna-university-professional-elective-iv\/"},"modified":"2021-05-22T07:40:40","modified_gmt":"2021-05-22T07:40:40","slug":"mf5005-electronics-manufacturing-technology-syllabus-for-manufacturing-7th-sem-2019-regulation-anna-university-professional-elective-iv","status":"publish","type":"post","link":"https:\/\/www.inspirenignite.com\/anna-university\/mf5005-electronics-manufacturing-technology-syllabus-for-manufacturing-7th-sem-2019-regulation-anna-university-professional-elective-iv\/","title":{"rendered":"MF5005: Electronics Manufacturing Technology Syllabus for Manufacturing 7th Sem 2019 Regulation Anna University (Professional Elective-IV)"},"content":{"rendered":"<p align=\"justify\">Electronics Manufacturing Technology detailed syllabus for Manufacturing Engineering (Manufacturing) for 2019 regulation curriculum has been taken from the <a class=\"rank-math-link\" href=\"https:\/\/cac.annauniv.edu\/\" style=\"color: inherit\" target=\"_blank\" rel=\"noopener\">Anna Universities<\/a> official website and presented for the Manufacturing students. For course code, course name, number of credits for a course and other scheme related information,  do visit full semester subjects post given below. <\/p>\n<p align=\"justify\">For Manufacturing Engineering 7th Sem scheme and its subjects, do visit <a class=\"rank-math-link\" href=\"..\/manufacturing-engineering-manufacturing-syllabus-for-7th-sem-2019-regulation-anna-university\">Manufacturing 7th Sem 2019 regulation scheme<\/a>. For Professional Elective-IV scheme and its subjects refer to <a class=\"rank-math-link\" href=\"..\/professional-elective-iv-syllabus-for-manufacturing-7th-sem-2019-regulation-anna-university\">Manufacturing Professional Elective-IV syllabus scheme<\/a>. The detailed syllabus of electronics manufacturing technology is as follows. <\/p>\n<p>  <title>Electronics Manufacturing Technology<\/title><\/p>\n<h4>Course Objective:<\/h4>\n<p id=\"istudy\" style=\"text-align:center\">For the complete syllabus, results, class timetable, and many other features kindly download the <a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy\" target=\"_blank\" rel=\"noopener\">iStudy App<\/a><br \/><b> It is a lightweight, easy to use, no images, and no pdfs platform to make students&#8217;s lives easier.<\/b><br \/><a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy&amp;pcampaignid=pcampaignidMKT-Other-global-all-co-prtnr-py-PartBadge-Mar2515-1\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/play.google.com\/intl\/en_us\/badges\/static\/images\/badges\/en_badge_web_generic.png\" alt=\"Get it on Google Play\" style=\"height:65px\"><\/a>.   <\/p>\n<h4>Unit I<\/h4>\n<p align=\"justify\">\n  <strong>Introduction To Electronics Manufacturing<\/strong><br \/>\n  History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed circuit board -fabrication, types, single sided, double sided, multi-layer and flexible printed circuit board\n<\/p>\n<h4>Unit II<\/h4>\n<p id=\"istudy\" style=\"text-align:center\">For the complete syllabus, results, class timetable, and many other features kindly download the <a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy\" target=\"_blank\" rel=\"noopener\">iStudy App<\/a><br \/><b> It is a lightweight, easy to use, no images, and no pdfs platform to make students&#8217;s lives easier.<\/b><br \/><a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy&amp;pcampaignid=pcampaignidMKT-Other-global-all-co-prtnr-py-PartBadge-Mar2515-1\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/play.google.com\/intl\/en_us\/badges\/static\/images\/badges\/en_badge_web_generic.png\" alt=\"Get it on Google Play\" style=\"height:65px\"><\/a>.   <\/p>\n<h4>Unit III<\/h4>\n<p align=\"justify\">\n  <strong>Surface Mount Technology<\/strong><br \/>\n  SMT Process, SMT equipment and material handling systems, handling of components and assemblies &#8211; moisture sensitivity and ESD, safety and precautions needed, IPC and other standards, stencil printing process &#8211; solder paste material, storage and handling, stencils and squeegees, process parameters, quality control. Component placement- equipment type, flexibility, accuracy of placement, throughput, packaging of components for automated assembly, soldering- wave soldering, reflow process, process parameters, profile generation and control, adhesive, underfill and encapsulation process\n<\/p>\n<h4>Unit IV<\/h4>\n<p id=\"istudy\" style=\"text-align:center\">For the complete syllabus, results, class timetable, and many other features kindly download the <a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy\" target=\"_blank\" rel=\"noopener\">iStudy App<\/a><br \/><b> It is a lightweight, easy to use, no images, and no pdfs platform to make students&#8217;s lives easier.<\/b><br \/><a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy&amp;pcampaignid=pcampaignidMKT-Other-global-all-co-prtnr-py-PartBadge-Mar2515-1\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/play.google.com\/intl\/en_us\/badges\/static\/images\/badges\/en_badge_web_generic.png\" alt=\"Get it on Google Play\" style=\"height:65px\"><\/a>.   <\/p>\n<h4>Unit V<\/h4>\n<p align=\"justify\">\n  <strong>Repair, Rework, Quality and Reliability of Electronics Assemblies<\/strong><br \/>\n  Repair and rework of PCB- Coating removal, base board repair, conductor repair, thermomechanical effects and thermal management, Reliability fundamentals, reliability testing, failure analysis, design for manufacturability, assembly, reworkability, testing, reliability, and environment.\n<\/p>\n<h4>Course Outcome:<\/h4>\n<p id=\"istudy\" style=\"text-align:center\">For the complete syllabus, results, class timetable, and many other features kindly download the <a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy\" target=\"_blank\" rel=\"noopener\">iStudy App<\/a><br \/><b> It is a lightweight, easy to use, no images, and no pdfs platform to make students&#8217;s lives easier.<\/b><br \/><a class=\"rank-math-link\" href=\"https:\/\/play.google.com\/store\/apps\/details?id=ini.istudy&amp;pcampaignid=pcampaignidMKT-Other-global-all-co-prtnr-py-PartBadge-Mar2515-1\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/play.google.com\/intl\/en_us\/badges\/static\/images\/badges\/en_badge_web_generic.png\" alt=\"Get it on Google Play\" style=\"height:65px\"><\/a>.   <\/p>\n<h4>Text Books:<\/h4>\n<p align=\"justify\">\n<ol>\n<li>Prasad R., &#8220;Surface Mount Technology &#8211; Principles and practice&#8221;,2nd Edition, Chapman and Hall., New York, 1997, ISBN 0-41-12921-3.<\/li>\n<li>Tummala R.R., &#8220;Fundamentals of microsystem packaging&#8221;, Tata McGraw Hill Co. Ltd., New Delhi, 2001, ISBN 00-71-37169-9.<\/li>\n<\/ol>\n<h4>References:<\/h4>\n<p align=\"justify\">\n<ol>\n<li>Harper C.A., &#8220;Electronic Packaging and Interconnection Handbook&#8221; 2nd Edition, McGraw Hill Inc., New York, N.Y., 1997, ISBN 0-07-026694-8.<\/li>\n<li>Lee N.C., &#8220;Reflow Soldering Process and Trouble Shooting SMT, BGA, CSP and Flip Chip Technologies&#8221;, Elsevier Science. United Kingdom, 2001.<\/li>\n<li>Puligandla Viswanadham and Pratap Singh., &#8220;Failure Modes and Mechanisms in Electronic Packages&#8221;, Chapman and Hall., New York, 1997, N.Y. ISBN 0-412-105591-8. Science and Technology, United Kingdom, 1997, ISBN 0750698756.<\/li>\n<li>Totta P., Puttlitz K. and Stalter K., &#8220;Area Array Interconnection Handbook&#8221;, Kluwer Academic Publishers, Norwell, MA, United States, 2001, ISBN 0-7923-7919-5.<\/li>\n<li>Zarrow P. and Kopp D., &#8220;Surface Mount Technology Terms and Concepts&#8221;, Elsevier, 1997.<\/li>\n<\/ol>\n<p align=\"justify\">For detailed syllabus of all the other subjects of Manufacturing Engineering 7th Sem, visit <a class=\"rank-math-link\" href=\"..\/category\/manufacturing+7th-sem\">Manufacturing 7th Sem subject syllabuses for 2019 regulation<\/a>. <\/p>\n<p align=\"justify\">For all Manufacturing Engineering results, visit <a class=\"rank-math-link\" href=\"https:\/\/www.inspirenignite.com\/anna-university\/anna-university-results\/\">Anna University Manufacturing all semester results<\/a> direct link. <\/p>\n","protected":false},"excerpt":{"rendered":"<p>Electronics Manufacturing Technology detailed syllabus for Manufacturing Engineering (Manufacturing) for 2019 regulation curriculum has been taken from the Anna Universities official website and presented for the Manufacturing students. For course [&hellip;]<\/p>\n","protected":false},"author":2297,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"footnotes":""},"categories":[56],"tags":[],"class_list":["post-33971","post","type-post","status-publish","format-standard","hentry","category-manf"],"_links":{"self":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/posts\/33971","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/users\/2297"}],"replies":[{"embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/comments?post=33971"}],"version-history":[{"count":0,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/posts\/33971\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/media?parent=33971"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/categories?post=33971"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.inspirenignite.com\/anna-university\/wp-json\/wp\/v2\/tags?post=33971"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}